Semiconductor
With highly integrated semiconductors such as cellular phone components, image processing technology is required for high-speed and high-precision alignment. In addition, image processing technology is used in distortion correction for high-power lens.
BGA Measurement
Measurement, defect inspection, shape and foreign substance inspection of BGA Terminal |
Lead Pins Inspection
Measurement of number of lead pins and pitch, coplanarity inspection. |
Application Examples:
- Bounder
FAST general-purpose image processing systems and libraries have been used in detecting the extraction position when bonding the wire and the status checking after bonding. - Mounter
FAST positioning systems and libraries are used in correcting the position of components after the vacuum picking with collets , and recognizing the position of the circuit board before the mounting. - Prober
FAST positioning systems have been used in finding and correcting the position of probe pins during the lighting inspection.
Other Solutions:
- Dispensing
- Circuit Board Pattern Measurement
- Line Width Measurement
- Parts Form Measurement
- BGA Measurement
- Package Measurement
- Via (through-hole) Measurement
- Chip Form Measurement
- IC Inspection
- Package Inspection
- Mold Inspection
- Character and Seal Inspection
- BGA Inspection
- Circuit Board Inspection
- Surface Inspection
- Solder Inspection
- Engraved Mark Recognition
- 2D Bar Code Reading